Vacuum technology delivers superior results across soldering applications. Key benefits include:
Removal of moisture and oxygen with nitrogen backfill
Faster, deeper surface cleaning with formic acid
Quick residue removal after cleaning
Void reduction during molten solder phase
Vacuum cooling for hermetic encapsulation
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Void-Free Solder Joints
- During reflow, chamber evacuation removes voids as bubbles escape the molten solder, reducing voids to under 5%. For large solder areas (e.g. IGBT), bubbles may remain trapped. In this case, applying positive pressure (2–3 bar) after vacuum further compresses and removes bubbles, ensuring excellent void reduction.
