MAT Die Bonders

MAT was founded in 2000 in order to design, develop and manufacture die bonding systems with high flexibility and high accuracy
MAT offers a full automatic system (6500) and manual loading/unloading systems (6200)
Both systems are capable of flip chip, eutectic, epoxy, wet stacked die, MCM die bonding applications.
Many different heating methods, dispensing, stamping and ultra-sonic are all available
Die & component presentation in wafer, waffle, gelpak and tape & reel are all available
Mature GUI to ease programming and promote further flexibility