Shinwa Dispensing Systems

The Shinwa dispensing division was formed in 2005, the mother company was formed in 1951. Shinwa dispensing group was formed to design and manufacture dispensing systems for advanced electronic packaging
Shinwa dispensing systems are designed to be able to handle extreme dispensing applications such as solder paste or Ag epoxy jetting with dot diameters of 100um. Another example is jetting underfill for chips with a gap of only 35um
Shinwa has also extensively worked to develop high speed jetting that has achieved up to 15 dots of solder paste / second
Shinwa is now by far the market leader for high speed automatic dispensing in Japan