Panacol designs, develops and manufactures adhesives for all types of electronic assembly processes including SMT, medical, die bonding and many other applications.
Hoenle designs, develops and manufactures uV lamp and LED UV curing devices. Hoenle offers devices from hand-held solutions to ultra high volume solutions.
Shinwa designs, develops and manufactures extremely high speed and high precision dispensing systems with a focus on high speed
jetting systems for solder paste and underfill applications
TPT designs and develops wire & die bonding systems for high flexibility and very simple ease of use. For example all TPT wire bonders can be used to do ball, wedge, ribbon, stud bumping, insulated wire and other wire bonding processes.
MAT designs and manufactures die bonders with unpara-lelled flexibility combined with very high precision. MAT die bonders are used for eutectic, flip chip, very large die attach, MCM packages etc. MAT die bonders can achieve up to +-3sigma placement accuracy.
xyztec designs and manufactures bond testers for wire & die bonding applications, plus many other applications such as adhesive bond testing. xyztec is the only system on the market to offer full automatic wire pull and ball shear systems along with standard manually operated systems.
Laserssel develops, designs and manufactures laser based reflow and rework systems. Taking advantage of the extreme temperature control that lasers offer allows Laserssel to offer systems that can precisely control the temperature across the work area.
SET designs and develops dispensing systems for small to medium dispensing applications. SET has competitively priced systems for most dispensing applications including jetting, air-pressure, volumetric and other dispensing methods.
Axend has a full set of equipment including die bonders, dispensers, wire bonder, laser reflow, plasma treatment, bond testers along with various adhesives and other materials. Using this equipment we also offer prototype manufacturing services.
