
TPT Wire & Die Bonding Systems
- TPT started in Germany in 2001 and is dedicated to designing and manufacturing easy to use and flexible wire & die bonding systems
- TPT manufactures manual, semi-automatic and full automatic thin and heavy wire bonders which are all extremely flexible in that by only changing the tool it is possible to ball bond, wedge bond, ribbon bond, stud bump, bond insulation wire and others
- With a TPT bonder and the proper tool it is possible to bond Au, Al, Cu, Ti, insulated wire and others.
- TPT also manufactures a semi-automatic die bonding system that is perfect for laboratories or prototyping
Contact us today for more information: [email protected] or visit our contact us page for your local sales person.