Invacu was established in 2008 to produce vacuum reflow soldering systems. Vacuum reflow is very good for voidless solder reflow processes. In this process flux is normally not used, Formic acid (HCOOH, also called methanoic acid) in nitrogen may be used in place of flux.

1. Voidless and fluxless solder reflow processes

2. Up to 650C

3. Various work sizes up to 420x420mm

4. Easy to program profiles