ELT Vacuum Curing Oven
The ELT Vacuum Pressure System utilizes patented technology that combines vacuum and pressure switching to effectively eliminate voids and trapped bubbles during curing processes.
It is designed to improve product quality and reliability in applications such as die attach, potting, underfill, printing, and OCA coating.
ELT vacuum curing ovens are widely used in semiconductor packaging, electronic assembly, 5G communication, new energy, automotive electronics,
Remove Voids. Improve Quality.
Key Features
Vacuum + Pressure switching technology for void-free curing
Effectively removes bubbles in die attach, potting, underfill, printing, and OCA coating
Designed for high reliability electronic and semiconductor processes
Pressure vessel certified chamber for safe operation
Built-in over-pressure and over-temperature protection
Optional Features
Oxygen level control
Volatile gas removal
Automatic door opening / closing
Eliminate Voids. Elevate Reliability.
