Panacol adhesives on top of tablet and laptop

Panacol Adhesives

Panacol designs, develops and manufactures adhesives for all types of electronic assembly processes including SMT, medical, die bonding and many other applications.

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Hoenle UV Curing

Hoenle UV Curing

Hoenle designs, develops and manufactures uV lamp and LED UV curing devices. Hoenle offers devices from hand-held solutions to ultra high volume solutions.

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Shinwa Dispensing Systems

Shinwa Dispensing Systems

Shinwa designs, develops and manufactures extremely high speed and high precision dispensing systems with a focus on high speed
jetting systems for solder paste and underfill applications

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TPT Wire & Die Bonding Systems

TPT Wire & Die Bonding Systems

TPT designs and develops wire & die bonding systems for high flexibility and very simple ease of use. For example all TPT wire bonders can be used to do ball, wedge, ribbon, stud bumping, insulated wire and other wire bonding processes.

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MAT Die Bonders

MAT designs and manufactures die bonders with unpara-lelled flexibility combined with very high precision. MAT die bonders are used for eutectic, flip chip, very large die attach, MCM packages etc. MAT die bonders can achieve up to +-3sigma placement accuracy.

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xyztec Bond Tester

xyztec designs and manufactures bond testers for wire & die bonding applications, plus many other applications such as adhesive bond testing. xyztec is the only system on the market to offer full automatic wire pull and ball shear systems along with standard manually operated systems.

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Laserssel Laser Reflow

Laserssel develops, designs and manufactures laser based reflow and rework systems. Taking advantage of the extreme temperature control that lasers offer allows Laserssel to offer systems that can precisely control the temperature across the work area.

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SET Dispensing Systems

SET designs and develops dispensing systems for small to medium dispensing applications. SET has competitively priced systems for most dispensing applications including jetting, air-pressure, volumetric and other dispensing methods.

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Prototype Build Solutions

Axend has a full set of equipment including die bonders, dispensers, wire bonder, laser reflow, plasma treatment, bond testers along with various adhesives and other materials. Using this equipment we also offer prototype manufacturing services.

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DeWeyl Wedge Tools

DeWeyl designs and manufactures high quality wedge bonding tools including ceramic tipped tools for extremely long lived tools, especially for heavy wire. One of DeWeyl’s strength is the amount of customization available for each tool.

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Relyon plasma

Relyon develops and manufactures plasma systems specifically for adhesive bonding applications where plasma treatment can improve the bonding strength between the substrate and adhesive.

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Orbray Bonding Capillaries

Orbray designs and develops wire bonding capillaries of the highest quality with the highest repeatability. Orbray has developed HIP ceramic capillaries along with both sapphire and ruby capillaries. Ruby capillaries have the longest life of any capillary material available today.

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Holdwell Bonding Wire

Holdwell manufactures aluminum and gold bonding wires for the wire bonding process. Holdwell’s strengths are fast delivery, competitive pricing and of course reliability.

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F&K Calibration Systems

F&K offers ultrasonic measurement and calibration systems that will help ensure that all of your wire bonders are operating exactly like they should. Useful for checking wire bonders after maintenance or service and also for checking new batches of bond tools.

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Nihon Genma Solder Paste

Nihon Genma designs and manufactures solder paste for new age SMT applications such as fine pitch printing, very small solder paste jetting and water soluble flux for easy cleaning after reflow.

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DL Technology Needles

DL designs and manufactures dispensing needles for advanced dispensing applications such as underfill or fine solder paste dispensing. DL was the first company to offer ceramic dispensing needles down to a 25um inner diameter.

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Invacu Vacuum Reflow Soldering System

Axend has a full set of equipment including die bonders, dispensers, wire bonder, laser reflow, plasma treatment, bond testers along with various adhesives and other materials. Using this equipment we also offer prototype manufacturing services.

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Nano-join

Nano-join GmbH is a German high tech materials company specializing in Ag sintering pastes Has developed general Ag sintering…

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ELT Vacuum Curing Oven

Axend has a full set of equipment including die bonders, dispensers, wire bonder, laser reflow, plasma treatment, bond testers along with various adhesives and other materials. Using this equipment we also offer prototype manufacturing services.

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UMEX UV Water Treatment

UMEX provides water treatment systems for drinking water systems, swimming pools, ship ballast treatment systems, TOC reduction and ultra-pure water systems…

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UV-Technik

UV-Technik is a German supplier of low & medium pressure uv lamps, electronic power supplies, UV-sensors,submersible and immersion tube systems and UV measuring devices…

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