Relyon develops and manufactures plasma systems specifically for adhesive bonding applications where plasma treatment can improve the bonding strength between the substrate and adhesive.
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Shinwa designs, develops and manufactures extremely high speed and high precision dispensing systems with a focus on high speed jetting systems for solder paste and underfill applications
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Panacol designs, develops and manufactures adhesives for all types of electronic assembly processes including SMT, medical, die bonding and many other applications.
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xyztec designs and manufactures bond testers for wire & die bonding applications, plus many other applications such as adhesive bond testing. xyztec is the only system on the market to offer full automatic wire pull and ball shear systems along with standard manually operated systems.
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