Laser Compression Bonder From LSR (solder ball reflow) to LCB (laser cleaning bonding) and rLSR (rework reflow) LSR (Laser Solder Reflow)Ultra-precise, localized heating for solder ball reflow with minimal thermal impact LCB (Laser Compression Bonding)High accuracy bonding for fine-pitch and next-gen semiconductor packaging rLSR (Rework Laser Reflow)Efficient and repeatable rework solution without damaging surrounding components…
Read article
BSC Solder systems Vapor Phase Soldering BSC SOLDER SYSTEMS designs and manufactures JUST SOLDER vapor phase soldering equipment in Dortmund, Germany. These systems provide reliable, user‑friendly solutions for SMD soldering, prototyping, small to medium production, rework, and special applications. Contact us Why Vapor Phase Soldering? Uniform, shadow-free heating Lead-free, max. 230 °C and minimal…
Read article
Laserssel aLSR Area Laser Solder Reflow System The Laserssel aLSR is a compact, low-cost laser solder reflow station designed for selective heating, rework, R&D, and testing applications.Using advanced area laser technology, the aLSR delivers uniform, precise, and repeatable heating—ideal for next-generation electronics assembly and repair. Why aLSR? Area Selective Reflow — Only reflow the area…
Read article
Laserssel develops, designs and manufactures laser based reflow and rework systems. Taking advantage of the extreme temperature control that lasers offer allows Laserssel to offer systems that can precisely control the temperature across the work area.
Read article
Nihon Genma designs and manufactures solder paste for new age SMT applications such as fine pitch printing, very small solder paste jetting and water soluble flux for easy cleaning after reflow.
Read article
Shinwa designs, develops and manufactures extremely high speed and high precision dispensing systems with a focus on high speed jetting systems for solder paste and underfill applications
Read article
Panacol designs, develops and manufactures adhesives for all types of electronic assembly processes including SMT, medical, die bonding and many other applications.
Read article
xyztec designs and manufactures bond testers for wire & die bonding applications, plus many other applications such as adhesive bond testing. xyztec is the only system on the market to offer full automatic wire pull and ball shear systems along with standard manually operated systems.
Read article
