F&K Calibration Systems

F&K offers ultrasonic measurement and calibration systems that will help ensure that all of your wire bonders are operating exactly like they should. Useful for checking wire bonders after maintenance or service and also for checking new batches of bond tools.

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DeWeyl Wedge Tools

DeWeyl designs and manufactures high quality wedge bonding tools including ceramic tipped tools for extremely long lived tools, especially for heavy wire. One of DeWeyl’s strength is the amount of customization available for each tool.

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MAT Die Bonders

MAT designs and manufactures die bonders with unpara-lelled flexibility combined with very high precision. MAT die bonders are used for eutectic, flip chip, very large die attach, MCM packages etc. MAT die bonders can achieve up to +-3sigma placement accuracy.

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Orbray Bonding Capillaries

Orbray designs and develops wire bonding capillaries of the highest quality with the highest repeatability. Orbray has developed HIP ceramic capillaries along with both sapphire and ruby capillaries. Ruby capillaries have the longest life of any capillary material available today.

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xyztec Bond Tester

xyztec designs and manufactures bond testers for wire & die bonding applications, plus many other applications such as adhesive bond testing. xyztec is the only system on the market to offer full automatic wire pull and ball shear systems along with standard manually operated systems.

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