Relyon develops and manufactures plasma systems specifically for adhesive bonding applications where plasma treatment can improve the bonding strength between the substrate and adhesive.
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Shinwa designs, develops and manufactures extremely high speed and high precision dispensing systems with a focus on high speed jetting systems for solder paste and underfill applications
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Hoenle designs, develops and manufactures uV lamp and LED UV curing devices. Hoenle offers devices from hand-held solutions to ultra high volume solutions.
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Panacol designs, develops and manufactures adhesives for all types of electronic assembly processes including SMT, medical, die bonding and many other applications.
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