Laser Compression Bonder
From LSR (solder ball reflow) to LCB (laser cleaning bonding) and rLSR (rework reflow)
- LSR (Laser Solder Reflow)
Ultra-precise, localized heating for solder ball reflow with minimal thermal impact - LCB (Laser Compression Bonding)
High accuracy bonding for fine-pitch and next-gen semiconductor packaging - rLSR (Rework Laser Reflow)
Efficient and repeatable rework solution without damaging surrounding components
Why Laser Reflow?
Replacing traditional reflow
Area Selective Reflow Only reflow the area you want
Laser Selective Reflow / Rework Capability
Precise time and temperature control with programmability
Selective Area Laser Reflow. Reliable Results.
