Shinwa Dispensing Systems
The Shinwa Quspa LX is the next evolution in solder paste jetting technology — designed to deliver industry-leading speed, precision, and flexibility for modern SMT production.
Super Fine. Super Fast.
Using Nihon Genma Type 7 solder paste, the Quspa LX can jet ultra-fine up to 100 µm dots with exceptional accuracy and consistency throughout the entire syringe.
Dual jet heads enable instant switching between large and fine dots — giving you flexibility, speed, and control in one compact system.
Engineered for Results
Designed for the demands of modern electronics manufacturing, the Quspa LX ensures stable, repeatable performance — maximizing yield and throughput across every board.
Jetting Like Never Before
Ideal For
High-mix SMT lines
Flex circuit assembly
Fine-pitch components
Next-generation packaging
