Xyztec designs and manufactures advanced bond testing solutions for a wide range of applications. While over 60% of usage is in wire bonding and die bonding, our systems are equally suited for adhesive bond testing, peel tests, and more.
Xyztec is the only bond tester offering full automation—from loading and positioning to testing and grading. Our platforms integrate seamlessly with factory software systems, and we back our software with a lifetime guarantee.
Contact us today for more information: [email protected] or visit our contact us page for your local sales person.
House up to 6 sensors
No more cartridge
exchanges
The Revolving Measurement Unit (RMU) houses up to 6 flexible sensors that are configurable with various pull, peel, push, or shear tools. This enables continuous testing up to 200 kgf.
Fully Automatic Testing and Grading capability
Proven Sigma performance
Sigma is the most advanced bond tester. It comes with game-changing automation capabilities and high specifications in:
- Sensor accuracy and resolution
- Large X stage
- Superior axis speed
- Cameras and illumination
- Future proof and modular design
