MAT Flipchip Die Bonder
MAT delivers 3 µm placement accuracy and high-precision die rotation for advanced semiconductor packaging.
Our portfolio includes both fully automatic (MAT 6500) and semi-automatic/manual loading systems (MAT 6200), providing the flexibility to support R&D, pilot production, and high-volume manufacturing.
Key Features
- High-accuracy die placement for advanced packaging
- Fully automatic or manual loading configurations
- Supports Flip Chip, Epoxy, Eutectic, Wet Stack Die, and MCM applications
- Multiple process options including dispensing, stamping, ultrasonic bonding, and various heating methods
- Compatible with wafer, waffle pack, Gel-Pak, and tape & reel material handling
3 µm Accuracy
High-Precision Die Rotation
