- To improve thermal properties, modern underfiller adhesives are equipped with nanofillers. These reduce the coefficient of thermal expansion (CTE) and thus increase reliability—a decisive advantage in temperature-sensitive applications.
- Epoxy resin-based adhesives are often used because of their impressive capillary flow behavior. They penetrate independently into the narrow spaces between the chip and the circuit board, enabling easy and complete application – even with complex structures.
- Dual-curing underfill systems are particularly efficient. The adhesive is first fixed in the edge area by UV light before complete heat curing takes place in the shadow zones under the component. This two-stage process ensures reliable and complete curing.
Vitralit®
Light-curing adhesives for high-precision applications in optics, electronics, and medical technology. Vitralit products cure rapidly under UV/visible light, offering transparency, low shrinkage, and reliable performance in demanding environments.
Penloc®
Two-component fast-curing structural adhesives. Penloc bonds metals, plastics, and composites within minutes, combining high strength with easy handling. Perfect for quick repairs, assembly lines, and production environments requiring speed and reliability.
Electrolit®
Specialty adhesives tailored for the electronics industry. Electrolit materials provide excellent electrical insulation, resistance to thermal cycling, and compatibility with automated dispensing processes – making them ideal for potting, encapsulation, and protective coatings.
Structalit®
One- and two-component epoxy and acrylate adhesives designed for structural bonding. Structalit adhesives deliver high mechanical strength, temperature resistance, and long-term durability for automotive, aerospace, and industrial assembly.
Cyanolit®
Cyanoacrylate adhesives (“instant adhesives”) that provide strong, fast bonds on a wide variety of substrates. Cyanolit products are ideal for quick fixes and small component assembly, offering versatility and convenience across many applications.
Selection of our Underfills
The table below provides an overview of Hoenle adhesives that are used as underfill. To download the technical datasheets (TDS) please click on the adhesive name.
Under fill | Appliction Detail | Viscosity [mPas] | Base/Curing | Special Properties |
| 300-400 (Rheometer, 25°C, 10s^-1) | epoxy | thermal |
| |
| 250 – 400 (Rheometer, 25 °C, 10s^-1) Newtonian fluid | epoxy | thermal |
| |
| 6,000 (Rheometer, 25 °C) Newtonian fluid | epoxy | thermal |
| |
| 350-850 (LVT, 25 °C, Sp. 3/60 rpm) | epoxy | UV / Secondary heat cure |
|
*UV = 320 – 390 nm VIS = 405 nm
