Underfill Dispensing & Jetting Solutions
From Reliable Dispensing to High-Speed, Ultra-Precision Jetting
Complete underfill solutions combining SET (San-Ei Tech) and SHINWA, covering cost-effective dispensing for low-throughput applications to high-speed, high-accuracy jetting for advanced semiconductor packaging.
Flexible Dispensing – Automated robots, precision valves and dispensing systems.
Reliable Performance – Consistent fluid control for underfill applications.
High-Speed Jetting – Exceptional accuracy and repeatability for high-throughput production.
SET | Reliable & Cost-Effective Dispensing
SHINWA | High-Speed & Ultra-High Precision Jetting
San-Ei Tech
Dispensing Solutions
Flexible and reliable dispensing and jetting systems for low-throughput applications at competitive prices.
Key Features
Vision-Guided Dispensing – PRS camera, Z-height sensing and X-Y calibration.
Flexible Work Areas – 200 × 200 mm to 600 × 600 mm.
Competitive Pricing – Reliable performance at an affordable cost.
Complete Dispensing Portfolio
Robots: Axelia, Cartesian & Janome
Valves: Jetting, Micro Dispense, Air Pressure, Dam & Fill, Spray
Controllers: Stable and precise process control
Needles: Plastic, SUS & Manifold
Accessories: Tanks, cartridges & adapters
Shinwa
High-Precision Jetting Solutions
Advanced jetting systems designed for high-throughput production requiring exceptional dispensing accuracy, speed and consistency.
High-Speed Jetting – Optimized for high-throughput manufacturing.
Ultra-High Accuracy – Precise and consistent fluid dispensing.
Advanced Technology – Reliable non-contact dispensing for demanding applications.
Jetting and Dispensing Solutions
Jetting Systems: High-speed, non-contact dispensing
Precision Control: Accurate and consistent fluid delivery
Automation: Designed for advanced semiconductor packaging applications
Website: www.shinwa-jp.com
