Nihon Genma Solder Paste
Since the 1950s, Nihon Genma Japan has specialized in high-performance solder pastes for advanced electronics.
Jetting Pastes: Ultra-precise application with dot sizes down to 100 µm.
Printable Pastes: Stable at room temperature, easy to store and ship.
Water-Soluble Pastes: Easy cleaning with DI water, leaving no residue.
Reliable soldering solutions for next-generation electronics.
Jetting Solder Paste
Type 5, 6 & 7 (type 8 in development) pastes specifically developed for jetting
World’s smallest stable dot (~114 µm)
Stable up to 10 million consecutive shots
Excellent wettability
In production now
Water Soluble Paste & Flux
Easy to clean water soluble solder paste with no clean flux soldering characteristics
Water-Soluble Paste
Low voids on BGA and fine-pitch parts
Stable tackiness > 24 hrs, smooth printability
DI-water washable with no residue
Various particle sizes available
Water-Soluble Flux
Excellent solderability on Au-plated pads
Halide ≤ 0.05% | Viscosity 30 Pa·s
Easily cleaned with 60 °C water — no residue
Area Laser Soldering Paste
Solder pastes specifically designed for very fast profiles & void ≤ 1.2%
Excellent wetting and printability
Room-temperature storage up to 6 months
Various particle sizes available
Low-Residue Paste & Flux
Low Residue Paste – Less than 3% flux residue after reflow
Excellent on Ni-plated pads
Low slump, good tackiness
Various particle sizes available
- Download TDS
Low Residue Flux – Less than 2.9% flux residue
Excellent wetting and tackiness
Excellent life after depositing
- Download TDS
