SET designs and develops dispensing systems for small to medium dispensing applications. SET has competitively priced systems for most dispensing applications including jetting, air-pressure, volumetric and other dispensing methods.
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Panacol designs, develops and manufactures adhesives for all types of electronic assembly processes including SMT, medical, die bonding and many other applications.
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MAT designs and manufactures die bonders with unpara-lelled flexibility combined with very high precision. MAT die bonders are used for eutectic, flip chip, very large die attach, MCM packages etc. MAT die bonders can achieve up to +-3sigma placement accuracy.
Read articlewww.nihongenma.co.jp Nihon Genma Low Residue / Water Soluble Solder Paste & FLux Water Soluble Solder Paste & Flux Easy Cleaning Perfect printing No slump during print or heating Excellent Wettability Less Flux Residue Type Solder Paste Solder Paste with Almost Noflux Residue after Reflow Easy Cleaning Perfect Wetting Low Residue, Less than 3% Residue After…
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Rehm Thermal Systems Innovative Thermal Systems for Electronics Manufacturing Since 1990, Rehm Thermal Systems has developed and manufactured advanced thermal processing equipment for the electronics and photovoltaic industries. Its solutions include convection and condensation soldering systems, as well as drying and coating systems, designed to meet demanding manufacturing requirements. 8 processseswith infinite possibilities! Convection Soldering…
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Laser Compression Bonder From LSR (solder ball reflow) to LCB (laser cleaning bonding) and rLSR (rework reflow) LSR (Laser Solder Reflow)Ultra-precise, localized heating for solder ball reflow with minimal thermal impact LCB (Laser Compression Bonding)High accuracy bonding for fine-pitch and next-gen semiconductor packaging rLSR (Rework Laser Reflow)Efficient and repeatable rework solution without damaging surrounding components…
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RUBIS Tweezers Swiss Craftsmanship You Can Trust For decades, Rubis has set the global standard for precision tweezers. Handcrafted in Switzerland, every pair is engineered with meticulous attention to detail—ensuring unmatched accuracy, durability, and performance. Applications Beauty & Personal Care – Eyebrow shaping, ingrown hair removal Medical & Laboratory – Fine handling with sterile precision…
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BSC Solder systems Vapor Phase Soldering BSC SOLDER SYSTEMS designs and manufactures JUST SOLDER vapor phase soldering equipment in Dortmund, Germany. These systems provide reliable, user‑friendly solutions for SMD soldering, prototyping, small to medium production, rework, and special applications. Contact us Why Vapor Phase Soldering? Uniform, shadow-free heating Lead-free, max. 230 °C and minimal…
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Laserssel aLSR Area Laser Solder Reflow System The Laserssel aLSR is a compact, low-cost laser solder reflow station designed for selective heating, rework, R&D, and testing applications.Using advanced area laser technology, the aLSR delivers uniform, precise, and repeatable heating—ideal for next-generation electronics assembly and repair. Why aLSR? Area Selective Reflow — Only reflow the area…
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High-precision, fully automatic coating machine that highly controls production processes and product quality AXELIA AXSC500
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