Axend has a full set of equipment including die bonders, dispensers, wire bonder, laser reflow, plasma treatment, bond testers along with various adhesives and other materials. Using this equipment we also offer prototype manufacturing services.
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DL designs and manufactures dispensing needles for advanced dispensing applications such as underfill or fine solder paste dispensing. DL was the first company to offer ceramic dispensing needles down to a 25um inner diameter.
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SET designs and develops dispensing systems for small to medium dispensing applications. SET has competitively priced systems for most dispensing applications including jetting, air-pressure, volumetric and other dispensing methods.
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Laserssel develops, designs and manufactures laser based reflow and rework systems. Taking advantage of the extreme temperature control that lasers offer allows Laserssel to offer systems that can precisely control the temperature across the work area.
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Nihon Genma designs and manufactures solder paste for new age SMT applications such as fine pitch printing, very small solder paste jetting and water soluble flux for easy cleaning after reflow.
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F&K offers ultrasonic measurement and calibration systems that will help ensure that all of your wire bonders are operating exactly like they should. Useful for checking wire bonders after maintenance or service and also for checking new batches of bond tools.
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DeWeyl designs and manufactures high quality wedge bonding tools including ceramic tipped tools for extremely long lived tools, especially for heavy wire. One of DeWeyl’s strength is the amount of customization available for each tool.
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MAT designs and manufactures die bonders with unpara-lelled flexibility combined with very high precision. MAT die bonders are used for eutectic, flip chip, very large die attach, MCM packages etc. MAT die bonders can achieve up to +-3sigma placement accuracy.
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Orbray designs and develops wire bonding capillaries of the highest quality with the highest repeatability. Orbray has developed HIP ceramic capillaries along with both sapphire and ruby capillaries. Ruby capillaries have the longest life of any capillary material available today.
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TPT designs and develops wire & die bonding systems for high flexibility and very simple ease of use. For example all TPT wire bonders can be used to do ball, wedge, ribbon, stud bumping, insulated wire and other wire bonding processes.
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