UV-Technik is a German supplier of low & medium pressure uv lamps, electronic power supplies, UV-sensors,submersible and immersion tube systems and UV measuring devices...
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F&K offers ultrasonic measurement and calibration systems that will help ensure that all of your wire bonders are operating exactly like they should. Useful for checking wire bonders after maintenance or service and also for checking new batches of bond tools.
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Axend provides quality Au, AlSi, AuAg, AuCu and Ag fine wire and ribbon, we also provide heavy Al wire and heavy Al ribbon. High quality materials with quick deliveries.
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DeWeyl designs and manufactures high quality wedge bonding tools including ceramic tipped tools for extremely long lived tools, especially for heavy wire. One of DeWeyl’s strength is the amount of customization available for each tool.
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MAT designs and manufactures die bonders with unpara-lelled flexibility combined with very high precision. MAT die bonders are used for eutectic, flip chip, very large die attach, MCM packages etc. MAT die bonders can achieve up to +-3sigma placement accuracy.
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Orbray designs and develops wire bonding capillaries of the highest quality with the highest repeatability. Orbray has developed HIP ceramic capillaries along with both sapphire and ruby capillaries. Ruby capillaries have the longest life of any capillary material available today.
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TPT designs and develops wire & die bonding systems for high flexibility and very simple ease of use. For example all TPT wire bonders can be used to do ball, wedge, ribbon, stud bumping, insulated wire and other wire bonding processes.
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xyztec designs and manufactures bond testers for wire & die bonding applications, plus many other applications such as adhesive bond testing. xyztec is the only system on the market to offer full automatic wire pull and ball shear systems along with standard manually operated systems.
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