MAT designs and manufactures die bonders with unpara-lelled flexibility combined with very high precision. MAT die bonders are used for eutectic, flip chip, very large die attach, MCM packages etc. MAT die bonders can achieve up to +-3sigma placement accuracy.
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Orbray designs and develops wire bonding capillaries of the highest quality with the highest repeatability. Orbray has developed HIP ceramic capillaries along with both sapphire and ruby capillaries. Ruby capillaries have the longest life of any capillary material available today.
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TPT designs and develops wire & die bonding systems for high flexibility and very simple ease of use. For example all TPT wire bonders can be used to do ball, wedge, ribbon, stud bumping, insulated wire and other wire bonding processes.
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Relyon develops and manufactures plasma systems specifically for adhesive bonding applications where plasma treatment can improve the bonding strength between the substrate and adhesive.
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Shinwa designs, develops and manufactures extremely high speed and high precision dispensing systems with a focus on high speed jetting systems for solder paste and underfill applications
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Hoenle designs, develops and manufactures uV lamp and LED UV curing devices. Hoenle offers devices from hand-held solutions to ultra high volume solutions.
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Panacol designs, develops and manufactures adhesives for all types of electronic assembly processes including SMT, medical, die bonding and many other applications.
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xyztec designs and manufactures bond testers for wire & die bonding applications, plus many other applications such as adhesive bond testing. xyztec is the only system on the market to offer full automatic wire pull and ball shear systems along with standard manually operated systems.
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